US 6,806,122 B2Granted

Ball grid array module

AssigneeInternational Business Machines Corporation

InventorsStefano Oggioni, Giuseppe Vendramin

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Abstract

A Plastic Ball Grid Array electronic package of the Cavity Down type for use in HF application. The present invention allows to reduce the overall thickness of the package, by tailoring the different mechanical portions of the module structure (interconnection balls, grounded stiffener thickness). A thin dielectric layer is laid on a metal (e.g. copper) stiffener. A chip is attached on the same side of the dielectric layer and the electrical connections between the chip and the pads are done with metallic traces running on the surface of the dielectric layer. The external rows of balls are not connected to the circuit traces; they are electrically connected to the metal stiffener to realize the lateral shielding for the HF applications. The connection between the balls and the metal stiffener (which acts as the ground plane) is done by means of photovias. One of the more important aspects of the present invention is the dramatic reduction of the parasitic impedance.

Claims11

Dependent claims

A method of making an electronic package, comprising the following steps:

providing a metal member;
positioning a dielectric layer on said metal member, wherein said dielectric layer comprises a photo-imageable dielectric material;
positioning a first plurality of electrically conductive members on said dielectric layer;
positioning an active element on said dielectric layer relative to said first plurality of electrically conductive members;
positioning a plurality of metallic traces on said dielectric layer;
connecting selected ones of said metallic traces with said active element and selected ones of said first plurality of electrically conductive members;
positioning a second plurality of electrically conductive members on said dielectric layer;
forming at least one electrically conductive via in said dielectric layer;
and
connecting electrically said at least one of said second plurality of electrically conductive members with said metal member, said second plurality of electrically conductive members not in electrical contact with said metallic traces.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application: 10/431,177Filed 8 May 2003 · division
Priority: GB 992531827 Oct 1999
Published: US 2003/0174478 A118 Sep 2003
Granted: 19 Oct 2004
Term ends: Not estimatedThe source records don’t support an estimate.

Classification17 codes

H10W 90/701
Package configurations: characterised by the relative positions of pads or connectors relative to package parts
H10W 42/20
Arrangements for protection of devices: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
H10W 42/263
Characterised by their shapes or dispositions: shielding bumps
H10W 70/655
Top-view layouts: fan-out layouts