Method of forming a conductive pattern on dielectric substrates
AssigneeAtotech Deutschland GmbH
InventorsMichael Guggemos, Franz Kohnle
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Abstract
To form a conductive pattern on dielectric substrates, a method is proposed in which a) a substrate covered with a metal film is coated with a protective layer which is formed by treating the metal film with a solution which contains at least one compound containing nitrogen, b) the protective layer is stripped away by UV radiation at least partially in the regions which do not correspond to the conductive pattern to be formed, in such a way that the metal film is exposed, and c) the exposed metal film is then removed by etching. By means of this method, extremely fine conductive patterns can be manufactured in a reproducible manner on dielectric substrates.
Claims13
Method of forming a conductive pattern on dielectric substrates, characterized in that:
- a) a substrate covered with a metal film is coated with a protective layer which is formed by treating the metal film with a solution containing at least one compound containing nitrogen,
- b) the protective layer is stripped away by UV radiation at least partially in the regions not corresponding to the conductive pattern to be formed, said protective layer being exhausted into a gas phase by the UV radiation stripping action, in such a way that the metal film is exposed, and
- c) the exposed metal film is removed by etching.
Dependencies are inferred from the claim text.