Integrated cooling substrate for extreme ultraviolet reticle
AssigneesInternational Business Machines Corporation, Photronics, Inc.
InventorsMichael J. Lercel, Dhirendra Prasad Mathur
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Abstract
The current invention provides a method and apparatus that minimizes the destructive effects of non-reflected energy during lithography. More specifically, a cooling system is located within the mask. In one example, a cooling module is integrated into the EUV mask. The cooling module may be thermoelectric. The EUV mask comprises a substrate structure as a base for a reticle, a cooling layer, which is formed on the substrate structure and a planarizing layer deposited on the cooling layer. In another example, a cooling channel is formed within the mask.
Claims20
A mask, wherein said mask comprises:
- a substrate;
- a cooling layer on said substrate;
- a planarizing layer on said cooling layer;
- and
- a mask absorber above said planarizing layer,
- wherein said substrate, said cooling layer, said planarizing layer, and said mask absorber comprise an integrated structure.
A mask blank comprising:
- a substrate having at least one cooling channel;
- a cooling fluid within said cooling channel;
- and
- a mask absorber above said substrate,
- wherein said substrate, said cooling channel, and said mask absorber comprise an integrated structure.
A method of making a mask blank, said method comprising:
- forming at least one cooling channel in a mask substrate;
- enclosing said channels with a cover material;
- and
- forming a mask absorber above said mask substrate layer,
- wherein said forming of said substrate, said cooling channel, and said mask absorber forms an integrated structure.
Dependencies are inferred from the claim text.