Method for applying hot-melt pressure sensitive adhesives to a backing material
AssigneeBeiersdorf AG
InventorsAxel von Wolff, Stefan Godersky, Robert Mayan, Andreas B. Kummer
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Abstract
A method of partially applying a hot-melt pressure sensitive adhesive composition to a backing material, in which the hot-melt pressure sensitive adhesive composition is applied by an applicator to a moving transfer means in such a way that a film formed from the hot-melt adhesive composition comprises voids; the film applied to the transfer means is subsequently applied to a backing material, which is likewise moving.
Claims7
A method of applying a hot-melt pressure sensitive adhesive composition to a backing material which comprises
- a) applying a hot-melt pressure sensitive adhesive to a moving transfer material at a rate, relative to the speed of the moving transfer material, that causes the applied hot-melt pressure sensitive adhesive to form a film on said moving transfer material, and said film to be torn as it is being formed, thereby resulting in a film which comprises voids, and
- b) transferring the film so formed from said moving transfer material to a moving backing material.
A method of applying a hot-melt pressure sensitive adhesive composition to a backing material which comprises applying a hot-melt pressure sensitive adhesive to a moving backing material at a rate, relative to the speed of the moving backing material, that causes the applied hot-melt pressure sensitive adhesive to form a film on said moving backing material, and said film to be torn as it is being formed, thereby resulting in a film which comprises voids.
Dependencies are inferred from the claim text.