US 6,805,778 B1Granted

Contact assembly for supplying power to workpieces during electrochemical processing

AssigneeSemitool, Inc.

InventorsRobert W. Batz, Jr., Kenneth C. Haugan, Harry J. Geyer, Robert W. Berner

Life of this patent

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Abstract

Methods used in semiconductor electroplating systems, such as for plating copper, onto a semiconductor wafer or other semiconductor workpiece. The methods apply to patterned metal layers plated onto a seed layer which is partially protected by an overlying photoresist or other coating. The methods employ an electrode assembly which has a boot which seals about a contact face of the electrode. The sealing is performed by engaging the seal against photoresist to prevent corrosion of the seal layer. The area enclosed by the sealing includes a via which is surrounded by the seal. The electrode contact extends through the via to provide electrical contact with the metallic seed layer. Plating of copper or other metal proceeds at exposed seed layer areas.

Claims3

Dependent claims

A contact assembly for supplying electrical power to a microelectronic workpiece during electrochemical processing of the microelectronic workpiece, the contact assembly comprising:

a workpiece holder configured to hold a workpiece face down;
a plurality of electrical contacts arranged along a perimeter area of the microelectronic workpiece, wherein individual electrical contacts include a first section located outside of the perimeter area of the workplace and projecting generally downward below the face of the wafer, a second section projecting inwardly from the first section to perimeter area of the workpiece, and a contact face at an end of the second section for contacting a processing surface of the workpiece upon which electrochemical processing is to occur;
and
a yieldable sealing system proximate the electrical contacts and configured to press against the surface of the microelectronic workpiece as the microelectronic workpiece and the electrical contacts are brought into engagement with one another in a manner that forms a seal against the processing surface of the microelectronic workpiece and thereby inhibits processing fluid from contacting the contact faces of the contacts.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 09/390,501Filed 3 Sep 1999 · continuation in part
Priority: 15 Jul 1996
Granted: 19 Oct 2004
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

B23H 11/006
Auxiliary apparatus or details, not otherwise provided for: electrical contacts or wires
H10P 72/7608
The wafers being placed on a susceptor, stage or support: characterised by a plurality of separate clamping members, e.g. clamping fingers
H10P 72/7624
The wafers being placed on a susceptor, stage or support: characterised by the mechanical construction of the susceptor, stage or support
B23H
Working of metal by the action of a high concentration of electric

Family

Application08/680,057Parent of this continuation · filed 15 Jul 1996
Application08/940,685Parent of this continuation · filed 30 Sep 1997
Application09/300,610Parent of this continuation-in-part · filed 27 Apr 1999
US 5,980,706 AParent of this continuation · filed 9 Nov 1999
US 6,001,234 AParent of this continuation · filed 14 Dec 1999
US 6,274,013 B1Parent of this continuation-in-part
Application09/300,610Parent of this continuation
US 6,805,778 B1This patent

From the US filing history. Foreign family members aren’t listed.