US 6,805,763 B2Granted

Stacked ceramic body and production method thereof

AssigneeDenso Corporation

InventorsAkio Iwase, Yukihisa Takeuchi, Tetuji Ito

Life of this patent

Estimating the term…

Loading patent…

Abstract

This invention provides a stacked ceramic body in which de-lamination (inter-layer peeling) does not easily occur, and a production method thereof. In the invention, a predetermined number of unit layers 151 and 152 each including a ceramic layer 111 112, an internal electrode layer 121, 122, a spacer 131, 132 having substantially the same thickness as the internal electrode layer 121, 122 and adhesive layers 14 stacked on the surface of the internal electrode layer and on the surface of the adhesive layer are stacked. A print portion for the internal electrode layer 121, 122 and a print portion for the spacer 131, 132 are formed on a green sheet for the ceramic layer 111, 112, and print portions for the adhesive layer 14 are formed on both of them to give an unsintered unit. The unsintered units are stacked to give an unsintered stacked body, are press-bonded and are then sintered.

Claims7

Dependent claims

A method for producing a stacked ceramic body by stacking a predetermined number of unit layers, each of said unit layers including a ceramic layer, an internal electrode layer stacked on at least a part of a surface of said ceramic layer, a spacer stacked on a surface of said ceramic layer at which said internal electrode layer is not formed, and having substantially the same thickness as said internal electrode layer, and adhesive layers stacked on a surface of said internal electrode layer and on a surface of said spacer, said method comprising the steps of:

preparing slurry for a ceramic layer, containing a ceramic material and a binder, slurry for an internal electrode layer, containing an electrode material and a binder, slurry for a spacer, containing a spacer material and a binder, and slurry for an adhesive layer, containing an adhesive layer material and a binder;
a binder content in said slurry for the adhesive layer being higher than a binder content in said slurry for the ceramic layer;
forming a green sheet for a ceramic layer from said slurry for the ceramic layer;
forming a print portion for the internal electrode layer on said green sheet for the ceramic layer by use of said slurry for the internal electrode layer;
forming a print portion for the spacer by use of said slurry for the spacer;
forming and stacking a print portion for the adhesive layer on said print portions for the internal electrode layer and for the spacer by use of said slurry for the adhesive layer to give an unsintered unit;
stacking a predetermined number of said unsintered units to give an unsintered stacked body;
and
pressing and bonding said unsintered stacked body and then sintering said unsintered stacked body.

6 more elements

preparing slurry for a ceramic layer, containing a ceramic material and a binder, slurry for an internal electrode layer, containing an electrode material and a binder, slurry for a spacer, containing a spacer material and a binder, and slurry for an adhesive layer, containing an adhesive layer material and a binder;
a binder content in said slurry for the adhesive layer being higher than a binder content in said slurry for the ceramic layer;
forming a large-scale green sheet capable of providing a plurality of green sheets for the ceramic layer from said slurry for the ceramic layer;
forming a print portion for the internal electrode layer on said large-scale green sheet by use of said slurry for the internal electrode layer;
forming a print portion for the spacer by use of said slurry for the spacer;
forming a print portion for the spacer on said large-scale green sheet by use of said slurry for the spacer;
forming and stacking a print portion for the adhesive layer on said print portions for the internal electrode layer and for the spacer by use of said slurry for the adhesive layer;
punching said large-scale green sheet to give unsintered units;
stacking and press-bonding said unsintered unit to other unsintered unit simultaneously with punching;
repeating said punching and press-bonding operation to give an unsintered stacked body;
and
sintering said unsintered stacked body.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application: 10/781,814Filed 20 Feb 2004 · division
Priority: JP 2001-3730086 Dec 2001
Published: US 2004/0159389 A119 Aug 2004
Granted: 19 Oct 2004
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

H10N 30/053
Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes: by…
H01G 4/30
Fixed capacitors; Processes of their manufacture: stacked capacitors
H10N 30/503
Having a stacked or multilayer structure: having a non-rectangular cross-section in a plane orthogonal to the stacking direction, e.g. polygonal…
H10N
Electric solid-state devices not otherwise provided for

Family

Application10/310,062Parent of this division · filed 5 Dec 2002
US 2004/0159389 A1Pre-grant publication · published 19 Aug 2004
US 6,721,163 B2Parent of this division
US 2003/0107867 A1Published application
US 6,805,763 B2This patent

From the US filing history. Foreign family members aren’t listed.