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US 6,805,754 B1Granted
Device and method for processing substrates
AssigneeSteag Micro Tech GmbH
InventorsJoachim Pokorny, Andreas Steinrücke
Life of this patent
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Abstract
A device and method for processing substrates, whereby medium consumption and processing time are reduced. According to the inventive method, liquid is conducted to a surface of the substrate that is to be treated via at least one nozzle that is arranged in a substantially centric position with respect to said substrate and via a plurality of second nozzles that are controlled separately from the first nozzle.
Claims28
An apparatus for processing substrates, comprising:
- a nozzle plate;
- and aligned with an upper surface of said nozzle plate, wherein said at least one first nozzle plate is capable of providing outwardly directed uniform flow over the upper surface of said nozzle plate;
- a plurality of second nozzles disposed in said nozzle plate at an angle of less than 90° relative thereto, wherein said second nozzles and said at least one first nozzle are separately controllable, wherein said second nozzles provide a flow therefrom directed transverse to said radial flow from said at least one first nozzle, and wherein said second nozzles are distributed over the surface of said nozzle plate such that said transverse flow therefrom deflects said radial flow from said at least one first nozzle into a spirally outwardly extending flow.
A method of processing substrates, including the steps of:
- providing at least one first nozzle, and a nozzle plate disposed parallel to a substrate fixed on a substrate carrier, wherein said at least one first nozzle is disposed essentially centrally relative to said substrate and aligned with said nozzle plate;
- conducting a fluid, via said at least one first nozzle, at a right angle onto a substrate surface that is to be treated so that fluid striking said substrate is deflected into a radial flow between said substrate and said nozzle plate;
- providing a plurality of second nozzles disposed in said nozzle plate and positioned at an angle of less than 90° relative to the nozzle plate, wherein said second nozzles and the at least one first nozzle are separately controlled;
- conducting a fluid transverse to said radial flow, onto said substrate surface that is to be treated via said plurality of second nozzles, wherein fluid is simultaneously conducted onto said substrate surface by said first and second nozzles;
- and
- wherein said second nozzles are distributed over the surface of said nozzle plate in such a way that said radial flow is deflected into a spirally outwardly extending flow.
3 more elements
Dependencies are inferred from the claim text.