US 6,805,495 B2 · Optical communication module

Abstract

The present invention provides an optical module in which the level of the lead frame coincides with the optical axis of the fiber. The module 1 comprises a container 4, a subassembly 2, a base member 5 and a lead frame 6. The subassembly 2 includes a substrate, on which the semiconductor optical device and the optical fiber are mounted. The container 4 has a pair of surface. One surface is securing the lead frame thereon while the base member is attached to the other surface of the container 4. The base member comprises an island portion and a frame portion. The subassembly 2 is placed on the island and the frame portion is fixed to the container 4. Island support portions connecting the island portion to the frame portion is deformed in the molding process, thus aligning the subassembly 2.

Claims12

Dependent claims

An optical communication module comprising:

a container;
a lead frame fixed to said container and having a primary surface;
a subassembly having a semiconductor optical device, an optical fiber coupled to said semiconductor device, and a ferrule for securing said optical fiber;
a base member fixed to said container for adjusting a position of said subassembly;
and
a resin molded housing for containing said container, said lead frame, said subassembly, and said base member,
wherein an optical axis of said optical fiber is set substantially within said primary surface of said lead frame;
and
wherein said ferrule and said lead frame protrude from said housing.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/230,402Filed 29 Aug 2002

Priority

JP 2001-26031829 Aug 2001

Published

US 2003/0044133 A16 Mar 2003

Granted

19 Oct 2004

Term ends

Not estimatedThe source records don’t support an estimate.

Classification8 codes

G02B 6/4201
Coupling light guides with opto-electronic elements: packages, e.g. shape, construction, internal or external details
G02B 6/4257
Details of housings: having a supporting carrier or a mounting substrate or a mounting plate
G02B 6/426
Details of housings: mounting, engaging or coupling of the package to a board, a frame or a panel
G02B 6/4265
Characterised by the shape of the housing: of the Butterfly or dual inline package [DIP] type

Optical communication module

Life of this patent

Optical communication module

Life of this patent

Abstract

Claims12