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US 6,805,432 B1Granted
Fluid ejecting device with fluid feed slot
AssigneeHewlett-Packard Development Company, L.P.
InventorsDonald J Milligan, Timothy L. Weber
Life of this patent
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Abstract
A method of forming a fluid ejecting device such as an ink jet printing device that includes forming a plurality of fluid drop generators on a first surface of a silicon substrate, forming a partial fluid feed slot in the silicon substrate by deep reactive ion etching, and forming a fluid feed slot by wet etching the partial fluid feed slot.
Claims18
A fluid ejecting device comprising:
- a silicon substrate having a <100> crystalline orientation;
- a plurality of fluid drop generators formed on a first surface of said silicon substrate;
- a fluid feed slot extending from a second surface of said silicon substrate to said first surface;
- said fluid slot formed by deep reactive ion etching from the second surface of said silicon substrate to a depth of at least one-half a thickness of the silicon substrate followed by anisotropic wet etching, and having an opening at the first surface having a width W1 that is less than a width W2 of an opening at the second surface.
1 more element
A fluid ejection device comprising:
- a silicon substrate having a <100> crystalline orientation;
- a plurality of fluid drop generators formed on a first surface of said silicon substrate;
- a fluid feed slot extending from a second surface of said silicon substrate to said first surface;
- said fluid slot formed by deep reactive ion etching from the second surface of said silicon substrate followed by anisotropic wet etching, and having an opening at the first surface having a width W1 that is less than a width W2 of an opening at the second surface, wherein said fluid feed slot was formed by deep reactive ion etching to a depth of at least one-half of a thickness of the substrate.
1 more element
A fluid ejecting device comprising:
- a silicon substrate having a <100> crystalline orientation;
- a plurality of fluid drop generators formed on a first surface of said silicon substrate;
- a fluid feed slot extending from a second surface of said silicon substrate to said first surface;
- said fluid slot formed by deep reactive ion etching followed by anisotropic wet etching, and having an opening at the first surface having a width W1 that is less than a width W2 of an opening at the second surface, wherein said fluid feed slot was formed by deep reactive ion etching to a depth of at least about 475 micrometers.
1 more element
A fluid ejection device comprising:
- a silicon substrate having a <100> crystalline orientation;
- a plurality of fluid drop generators formed on a first surface of said silicon substrate;
- a fluid feed slot extending from a second surface of said silicon substrate to said first surface;
- said fluid slot formed by deep reactive ion etching from the second surface of said silicon substrate followed by anisotropic wet etching, and having an opening at the first surface having a width W1 that is less than a width W2 of an opening at the second surface, wherein the substrate has a thickness of about 675 micrometers or less;
- and
- wherein said fluid feed slot was formed by deep reactive ion etching to a depth of at least one-half of a thickness of the substrate.
3 more elements
A fluid ejecting device comprising:
- a silicon substrate <100> crystalline orientation;
- a plurality of fluid drop generators formed on a first surface of said silicon substrate;
- a fluid feed slot extending from a second surface of said silicon substrate to said first surface;
- said fluid slot formed by deep reactive ion etching followed by anisotropic wet etching, and having an opening at the first surface having a width W1 that is less than a width W2 of an opening at the second surface, wherein the substrate has a thickness of about 675 micrometers or less;
- and
- wherein said fluid feed slot was formed by deep reactive ion etching to a depth of at least about 475 micrometers.
3 more elements
A fluid ejecting device comprising:
- a silicon substrate having a <100> crystalline orientation;
- a plurality of fluid drop generators formed on a first surface of said silicon substrate;
- a fluid feed slot extending from a second surface of said silicon substrate to said first surface;
- said fluid slot formed by deep reactive ion etching followed by anisotropic wet etching, and having an opening at the first surface having a width W1 that is less than a width W2 of an opening at the second surface,
- wherein the substrate has a thickness STH;
- said fluid feed slot was formed by deep reactive ion etching to a depth DD, with an angle of re-entrancy α;
- and
- W1 equals about W2+2(DD*tan α+(DD−STH/tan(54.7 deg.))).
5 more elements
A fluid ejecting device comprising:
- a silicon substrate having a <100> crystalline orientation and a thickness STH;
- a plurality of fluid drop generators formed on a first surface of said silicon substrate;
- a fluid feed slot extending from a second surface of said silicon substrate to said first surface;
- said fluid slot being formed at least in part by deep reactive ion etching to a depth DD, with an angle of re-entrancy α, and having an opening at the first surface having a width W1 that is less than a width W2 of an opening at the second surface, wherein W1 equals about W2+2(DD*tan α+(DD−STH/tan(54.7 deg.))).
1 more element
Dependencies are inferred from the claim text.