US 6,805,282 B2 · Flow soldering process and apparatus

Abstract

There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material. In the flow soldering process, thermal efficiency of flow soldering is improved in preheating step and/or solder material supplying step thereof. In one aspect of the present invention, a heating cover is located above a preheater, and the flow soldering is conducted while the board passes between the heating cover and the preheater. In another aspect of the present invention, a gap between a preheater and a solder bath is 20 to 60 mm. In yet another aspect of the present invention, a distance between a primary wave and a secondary wave is not larger than 60 mm.

Claims8

Dependent claims

A flow soldering process for mounting an electronic component onto a board with a solder material, the process comprising:

preheating the board by using a preheater located under the board, the board being provided with the electronic component and being conveyed;
and
supplying the solder material in its molten state to the board by successively contacting a lower surface of the board, which has previously been heated, with a primary wave of the solder material and a secondary wave of the solder material,
wherein a temperature decrease of the board during a period after being previously heated and before contacting the primary wave is not larger than 3° C.

1 more element

Dependencies are inferred from the claim text.

Flow soldering process and apparatus

Life of this patent

Flow soldering process and apparatus

Life of this patent

Abstract

Claims8