Z interconnect structure and method
AssigneeInternational Business Machines Corporation
InventorsLisa J. Jimarez, Mark V. Pierson
Life of this patent
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Abstract
The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive surface, removing a portion of the flux from the paste and joining the two cores. The current invention also provides a structure including a plurality of cores wherein a metallurgical paste electrically connects a via with a conductive surface on a core to a conductive surface on another core.
Claims20
A method of attaching a first core to a second core, wherein the first core includes a via having a first conductive surface and wherein the second core includes a second conductive surface, the method comprising the steps of:
- applying a metallurgical paste onto the first conductive surface, the metallurgical paste including flux;
- removing a portion of the flux from the metallurgical paste without causing reflow of the metallurgical paste;
- providing an adhesive sheet having an opening that substantially conforms to the first conductive surface and the second conductive surface;
- interposing the adhesive sheet between the first core and the second core such that the metallurgical paste on the first conductive surface aligns and contacts the second conductive surface;
- and
- joining the first core and the second core.
A method of attaching a first core to a second core, wherein the first core includes a pad having a first conductive surface and wherein the second core includes a via having a second conductive surface, the method comprising the steps of:
- applying a metallurgical paste onto the first conductive surface, the metallurgical paste including flux;
- removing a portion of the flux from the metallurgical paste without causing reflow of the metallurgical paste;
- providing an adhesive sheet having an opening that substantially conforms to the first conductive surface and the second conductive surface;
- interposing the adhesive sheet between the first core and the second core such that the metallurgical paste on the first conductive surface aligns and contacts the second conductive surface;
- and
- joining the first core and the second core.
A method of attaching a first core to a second core, wherein the first core includes a first conductive surface, the second core includes a second conductive surface, and wherein at least one of the first and second conductive surfaces comprises a via, the method comprising:
- applying a metallurgical paste onto the first conductive surface, the metallurgical paste including flux;
- removing a portion of the flux from the metallurgical paste without causing reflow of the metallurgical paste;
- providing an adhesive sheet having an opening that substantially conforms to the first conductive surface and the second conductive surface;
- interposing the adhesive sheet between the first core and the second core such that the metallurgical paste on the first conductive surface aligns and contacts the second conductive surface;
- and
- joining the first core and the second core subsequent to the removing step.
Dependencies are inferred from the claim text.