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US 6,805,048 B2Granted
Method of marking a substrate using an electret stencil
Assignee3M Innovative Properties Company
InventorsScott D. Pearson, Vivek Bharti
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Abstract
A stencil comprises an electret film, wherein the film has at least one perforation having a perimeter that defines an area, and wherein the area is greater than or equal to about one square centimeter. Methods of marking a substrate using stencils of the present invention are also disclosed.
Claims14
A method of marking a substrate comprising:
- providing an electret stencil comprising an electret film having a first major surface, a second major surface opposed to the first major surface, and at least one perforation extending through the film and connecting the first and second major surfaces;
- providing a substrate having a surface;
- electrostatically and removably adhering the stencil to the surface of the substrate;
- applying a medium to the surface of the substrate through the at least one perforation of the stencil;
- and
- removing the stencil from the surface of the substrate.
3 more elements
Dependencies are inferred from the claim text.