Thermal dissipation assembly employing thermoelectric module with multiple arrays of thermoelectric elements of different densities

A cooled electronic module comprising:

• an electronic device having a non-uniform thermal distribution across a surface thereof between at least one first region of said surface and at least one second region of said surface, wherein said at least one first region has higher heat flux than said at least one second region;
• and
• a thermoelectric assembly coupled to said surface of said electronic device, said thermoelectric assembly including at least one first area of thermoelectric elements and at least one second area of thermoelectric elements, said at least one first area of thermoelectric elements being aligned over said at least one first region of higher heat flux, and said at least one second area of thermoelectric elements being aligned over said at least one second region, wherein said at least one first area of thermoelectric elements comprises a greater density of thermoelectric elements than said at least one second area of thermoelectric elements.

A method of fabricating a thermal dissipation assembly for an electronic device, said method comprising:

• providing a thermoelectric assembly configured to couple to a surface of an electronic device, said electronic device having a non-uniform thermal distribution across said surface between at least one first region of said surface and at least one second region of said surface, wherein said at least one first region has a higher heat flux than said at least one second region;
• and
• wherein said providing of the thermoelectric assembly includes providing at least one first area of thermoelectric elements and at least one second area of thermoelectric elements, said at least one first area of thermoelectric elements being configured for at least partial alignment to said at least one first region of higher heat flux when said thermoelectric assembly is coupled to said surface of said electronic device, and said at least one second area of thermoelectric elements being configured for at least partial alignment to said at least one second region when the thermoelectric assembly is coupled to said surface of said electronic device, and wherein said at least one first area of thermoelectric elements comprises a greater density of thermoelectric elements than said at least one second area of thermoelectric elements.