Method for manufacturing printer device
AssigneeSony Corporation
InventorKoichiro Kishima
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Abstract
A method for splitting a piezoelectric device used in substitution for dicing for shortening the processing time as compared to a case of using the dicing to improve productivity to enable the shape of the piezoelectric device more suited to the emission shape of a solution to be achieved, and a method for manufacturing a printer device whereby a narrower nozzle pitch may be achieved. A resist 201 is formed at a pre-set position on a major surface of the piezoelectric device 43 bonded to a vibrating plate. Using this resist 201 as a mask, powders or particles are sprayed onto the piezoelectric device 43 for removing the portion of the piezoelectric device 43 not carrying the resist 201 to form the piezoelectric device 35 of a desired shape at a pre-set position.
Claims1
In a method of manufacturing a printer device having a pressuring chamber communicating with a liquid emission hole, a vibrating plate forming a portion of a sidewall section of said pressuring chamber, and a piezoelectric device arranged in contact with the vibrating plate, in which a liquid in said pressurizing chamber is emitted via said liquid emission hole by displacement of said piezoelectric device and the vibrating plate, wherein the improvement resides in that
- said vibrating plate has first and second layers;
- and in that the manufacturing method comprises
- a step of forming the piezoelectric device in contact with said second layer;
- a step of processing said piezoelectric device by spraying powders or particles;
- and
- a step of removing an area of said second layer not covered by said piezoelectric device by wet etching.
Dependencies are inferred from the claim text.