Method for producing a pressure sensor

A pressure sensor produced according to a method comprising the steps of:

• mounting a semiconductor pressure pick-up on a mounting section of a lead grid;
• electrically connecting the semiconductor pressure pick-up to contact sections of the lead grid;
• inserting the lead grid, together with the semiconductor pressure pick-up, into an injection molding die;
• bringing one of an upper die part and a lower die part of the injection molding die into contact at one of a side of the semiconductor pressure pick-up facing away from the mounting section and at a side of the mounting section facing away from the semiconductor pressure pick-up;
• subsequently enclosing the semiconductor pressure pick-up in the injection molding die by a housing made of a mold compound;
• holding clamped the mounting section of the lead grid in the injection molding die when producing the housing, wherein:
• an extension region of the mounting section of the lead grid is not embedded in the mold compound and extends out laterally from the housing of the pressure sensor;
• clamping between the upper die part and the lower die part a region of the mounting section extending laterally from an assembly region of the semiconductor pressure pick-up;
• and
• causing one of the upper die part and the lower die part to cover a pressure channel formed in the mounting section below the semiconductor pressure pick-up.