Multilayer circuit board manufacturing process

A method for the formation of a multilayer circuit board, said method comprising:

• forming a first layer by applying a first dielectric coating onto an electrically conductive support,
• forming first recesses in said first dielectric coating that define solder mount pads, electroplating solder into said first recesses,
• forming a second layer by applying colloidal palladium over said first layer, applying a second dielectric coating onto said second layer,
• forming second recesses in said second dielectric coating that define first signal lines where said second recesses are in electrical communication with the solder mount pads in the first layer,
• contacting said second layer with a divalent sulfur salt, electroplating copper into said second recesses to form the first signal lines,
• forming a third layer by applying colloidal palladium over the second dielectric coating, applying a third dielectric coating onto said third layer,
• forming third recesses in said third dielectric coating that define interconnections where said third recesses are in electrical communication with the signal lines in the second layer,
• contacting said third layer with a divalent sulfur compound, electroplating copper into said recesses to form interconnections, and
• repeating said method to form a desired number of layers in the multilayer circuit board.