Method of fabricating a magnetic transducer with a write head having a multi-layer coil

A method of fabricating a write head for a magnetic transducer on a wafer comprising the steps of:

• depositing a ferromagnetic material to form a first pole piece on the wafer below a planned write gap;
• depositing a first layer of polymeric material over the wafer;
• forming a first layer stack including a first hard mask layer and a first masked photoresist layer with the first masked photoresist layer being above the first hard mask layer with the first masked photoresist layer defining a coil shape behind the first pole piece;
• etching through the first layer stack and the first layer of polymeric material according to the first masked photoresist layer to form a first set of trenches in a coil shape;
• depositing a first seed layer over the wafer;
• depositing a first conductive material on the wafer over the first seed layer until the first set of trenches has been overfilled;
• planarizing the wafer to remove material from the wafer until the first set of trenches is exposed and a first coil layer comprising a plurality of turns of the first conductive material has been formed;
• forming a planned gap layer on the wafer;
• forming a second pole piece of ferromagnetic material at the write gap and above the gap layer;
• depositing a second layer of polymeric material over the wafer;
• forming a second layer stack including a second hard mask layer and a second masked photoresist layer with the second masked photoresist layer being above the second hard mask layer with the second masked photoresist layer defining a coil shape behind the second pole piece;
• etching through the second layer stack and the second layer of polymeric material according to the second masked photoresist layer to form a second set of trenches in a coil shape;
• depositing a second seed layer over the wafer;
• depositing a second conductive material on the wafer until the second set of trenches has been overfilled;
• planarizing the wafer to remove material from the wafer until the second set of trenches is exposed and a second coil layer comprising a plurality of turns of the second conductive material has been formed;
• forming a third coil layer above the second coil layer;
• encapsulating the third coil layer in an insulating material and
• forming a third pole piece over the insulating material for the third coil thereby completing a yoke.