Write once read only memory employing charge trapping in insulators
AssigneeMicron Technology, Inc.
InventorLeonard Forbes
Life of this patent
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Abstract
Structures and methods for write once read only memory employing charge trapping in insulators are provided. The write once read only memory cell includes a metal oxide semiconductor field effect transistor having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, and a gate separated from the channel region by a gate insulator. A plug couples the first source/drain region to an array plate. A bitline is coupled to the second source/drain region. The MOSFET can be programmed by operation in a reverse direction trapping charge in the gate insulator adjacent to the first source/drain region such that the programmed MOSFET operates at reduced drain source current when read in a forward direction.
Claims36
A write once read only memory cell, comprising:
- a metal oxide semiconductor field effect transistor (MOSFET) in a substrate, the MOSFET having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, and a gate separated from the channel region by a gate insulator;
- a plug coupled to the first source/drain region, wherein the plug couples the first source/drain region to an array plate;
- a transmission line coupled to the second source/drain region;
- and
- wherein the MOSFET is a programmed MOSFET having a charge trapped in the gate insulator adjacent to the first source/drain region such that the channel region has a first voltage threshold region (Vt1) and a second voltage threshold region (Vt2) and such that the programmed MOSFET operates at reduced drain source current.
A write once read only memory cell, comprising:
- a metal oxide semiconductor field effect transistor (MOSFET) in a substrate, the MOSFET having a source region, a drain region, a channel region between the source region and the drain region, and a gate seperated from the channel region by a gate insulator;
- a wordline coupled to the gate;
- an array plate coupled to the source region;
- a bit line coupled to the drain region;
- and
- wherein the MOSFET is a programmed MOSFET having a charge trapped in the gate insulator adjacent to the source region such that the channel region has a first voltage threshold region (Vt1) adjacent to the drain region and a second voltage threshold region (Vt2) adjacent to the source region, the Vt2 having a greater voltage threshold than Vt1 and such that the programmed MOSFET operates at reduced drain source current.
A memory array, comprising:
- a number of write once read only memory cells, wherein each write once read only memory cell includes a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, and a gate separated from the channel region by a gate insulator;
- a number of bit lines coupled to the second source/drain region of each write once read only memory cell along rows of the memory array;
- a number of word lines coupled to the gate of each write once read only memory cell along columns of the memory array;
- an array plate, wherein the first source/drain region of each write once read only memory cell is coupled to the array plate by a conductive plug;
- and
- wherein at least one of write once read only memory cells is a programmed MOSFET having a charge trapped in the gate insulator adjacent to the first source/drain region such that the channel region has a first voltage threshold region (Vt1) and a second voltage threshold region (Vt2) and such that the programmed MOSFET operates at reduced drain source current.
A memory device, comprising:
- a memory array, wherein the memory array includes a number of write once read only memory cells, wherein each write once read only memory cell includes a source region, a drain region, a channel region between the source and the drain regions, and a gate separated from the channel region by a gate insulator;
- a number of bitlines coupled to the drain region of each write once read only memory cell along rows of the memory array;
- a number of wordlines coupled to the gate of each write once read only memory cell along columns of the memory array;
- an array plate, wherein the source region of each write once read only memory cell is coupled to the array plate by a conductive plug;
- a wordline address decoder coupled to the number of wordlines;
- a bitline address decoder coupled to the number of bitlines;
- a sense amplifier coupled to the number of bitlines;
- and
- wherein at least one of write once read only memory cells is a programmed MOSFET having a charge trapped in the gate insulator adjacent to the source region such that the channel region has a first voltage threshold region (Vt1) and a second voltage threshold region (Vt2) and such that the programmed MOSFET operates at reduced drain/source current.
An electronic system, comprising:
- a processor;
- and
- a memory device coupled to the processor, wherein the memory device includes;
- a memory array, wherein the memory array includes a number of write once read only memory cells, wherein each write once read only memory cell includes a source region, a drain region, a channel region between the source and the drain regions, and a gate separated from the channel region by a gate insulator;
- a number of bitlines coupled to the drain region of each write once read only memory cell along rows of the memory array;
- a number of wordlines coupled to the gate of each write once read only memory cell along columns of the memory array;
- an array plate, wherein the source region of each write once read only memory cell is coupled to the array plate by a conductive plug;
- a wordline address decoder coupled to the number of wordlines;
- a bitline address decoder coupled to the number of bitlines;
- a sense amplifier coupled to the number of bitlines;
- and
- wherein at least one of write once read only memory cells is a programmed MOSFET having a charge trapped in the gate insulator adjacent to the source region such that the channel region has a first voltage threshold region (Vt1) and a second voltage threshold region (Vt2), wherein Vt2 is adjacent the source region of the programmed MOSFET and the programmed MOSFET operates at reduced drain/source current.
Dependencies are inferred from the claim text.