Indirect monitoring of semiconductor light source within a photonic package
AssigneeNetwork Elements, Inc.
InventorsDavid R. Ohm, Richard A. Booman
Life of this patent
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Abstract
A photonic package includes a housing having a semiconductor light source disposed within the housing. The semiconductor light source has a first output and a second output. A reflective surface is disposed inside the housing to reflect the second output from the semiconductor light source. A photodetector is also disposed within the housing and is adapted to indirectly receive the second output of the semiconductor light source reflected off the reflective surface. As a result, interior surface of a housing of an optical transponder may be utilized to provide reflected light to a photodetector to monitor the semiconductor light source.
Claims16
A photonic package comprising:
- a housing;
- a semiconductor light source disposed within the housing, the semiconductor light source having a first output and a second output;
- a first reflective surface disposed inside the housing selected from one of a side wall of the housing and an interior surface of a cover of the housing to reflect said second output;
- a second reflective surface to deflect the second output to the first reflective surface;
- and
- a photodetector disposed within the housing adapted to indirectly receive said second output of the semiconductor light source reflected off said first reflective surface.
A method for forming a photonic package comprising:
- providing a semiconductor light source to provide a first and a second output;
- providing a first reflective surface to reflect the second output of the semiconductor light source, wherein said providing of a first reflective surface comprises providing a reflective interior surface to a housing of the photonic package;
- providing a second reflective surface and disposing said second reflective surface in a manner such that said second reflective surface reflects said second output of the semiconductor light source to said reflective interior surface of the housing, for reflection to said photodetector;
- and
- adapting a photodetector to indirectly receive the second output of the semiconductor light source reflected from the interior surface.
A photonic package comprising:
- a housing;
- a semiconductor light source disposed within the housing, the semiconductor light source having a first output and a second output;
- a first reflective surface disposed inside the housing to reflect said second output;
- a second reflective surface to deflect the second output to the first reflective surface, at least one of said first and said second reflective surfaces is selected from one of a side wall of the housing and an interior surface of a cover of the housing;
- and
- a photodetector disposed within the housing adapted to indirectly receive said second output of the semiconductor light source reflected off said first reflective surface.
Dependencies are inferred from the claim text.