Method of bonding a conductive adhesive and an electrode, and a bonded electrode obtained thereby
AssigneeMurata Manufacturing Co., Ltd.
InventorHaruhiko Ikeda
Life of this patent
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Abstract
The present invention relates to a method of bonding a conductive adhesive and an electrode together, which is capable of obtaining electrical bonding between a conductive electrode and an electrode. In this method, a conductive adhesive containing a conductive filler and an organic binder is coated on an electrode having a layer formed thereon by plating a low-melting-point material, and then heated to cure the organic binder and melt the plated layer on the electrode. As a result, the conductive filler contained in the adhesive enters the plated layer to obtain strong bonding between the plated layer and the conductive filler.
Claims7
A bonded structure comprising:
- a first substrate;
- a first electrode formed on the first substrate;
- a first low-melting-point material formed on the first electrode;
- and
- an organic binder formed on the first low-melting-point material, the organic binder including a conductive filler, wherein at least a part of the conductive filler is present within the first low-melting-point material, and wherein the conductive filler and the first low-melting-point material are fusion-bonded together.
A bonding structure comprising:
- a first substrate;
- a first electrode formed on the first substrate;
- a first low-melting-point material formed on the first electrode;
- and
- an organic binder formed on the first low-melting-point material, the organic binder including a conductive filler, wherein at least a part of the conductive filler is present within the first low-melting-point material, the conductive filler and the first low-melting-point material are fusion-bonded together, and the first low-melting-point material comprises a Sn—Pb alloy.
A bonding structure comprising:
- a first substrate;
- a first electrode formed on the first substrate;
- a first low-melting-point material formed on the first electrode;
- an organic binder formed on the first low-melting-point material, the organic binder including a conductive filler, wherein at least a part of the conductive filler is present within the first low-melting-point material;
- a second substrate;
- a second electrode formed on the second substrate;
- and
- a second low-melting-point material formed on the second electrode and connected to the organic binder, wherein at least a part of the conductive filler is present within the second low-melting-point material,
- wherein the first and second low-melting-point material comprise a Sn—Pb alloy, and wherein the conductive filler is fusion-bonded to the first low-melting-point material and the second low-melting-point material.
A bonding structure comprising:
- a first substrate;
- a first electrode formed on the first substrate;
- a first low-melting-point material formed on the first electrode;
- and
- an organic binder formed on the first low-melting-point material, the organic binder including a conductive filler, wherein at least a part of the conductive filler is present within the first low-melting-point material, the conductive filler and the first low-melting-point material are fusion-bonded together, and the conductive filler comprises solder particles.
Dependencies are inferred from the claim text.