Epoxy resin compositions, solid state devices encapsulated therewith and method

A packaged solid state device comprising:

• (a) a package;
• a chip;
• and (c) an encapsulant comprising:
• (A) at least one silicone resin, (B) at least one epoxy resin, (C) at least one anhydride curing agent, (D) at least one siloxane surfactant, and (E) at least one ancillary curing catalyst, wherein the silicone resin comprises a silicone resin selected from the silicone resin in structure (I)
• wherein R is independently at each occurrence a hydroxyl group, C1-22 alkyl, C1-22 alkoxy, C2-22 alkenyl, C6-14 aryl, C6-22 alkyl-substituted aryl, C6-22 aralkyl, or OSiR3 wherein R3 is independently at each occurrence hydroxyl, C1-22 alkyl, C1-22 alkoxy, C2-22 alkenyl, C6-14 aryl, C6-22 alkyl-substituted aryl, or C6-22 aralkyl;
• and wherein z is in a range between about 1 and about 10.

A packaged solid state device, wherein the solid state device is an opto-electronic device, comprising:

• (a) a package;
• a chip;
• and (c) an encapsulant comprising:
• (A) at least one silicone resin, (B) at least one epoxy resin, (C) at least one anhydride curing agent, (D) at least one siloxane surfactant, and (E) at least one ancillary curing catalyst.

A LED device comprising:

• (a) a package;
• a LED chip;
• and (c) an encapsulant comprising:
• (A) a silicone resin comprising a hydroxyfunctional silicone resin, (B) an epoxy resin comprising a bisphenol F resin, (C) an anhydride curing agent comprising hexahydro-4-methylphthalic anhydride, (D) a siloxane surfactant comprising propylene oxide modified siloxane, and (E) a ancillary curing catalyst comprising zinc octoate, wherein component (A) is present at a level of greater than about 40% by weight;
• component (B) is present at a level in a range of between about 1% by weight and about 20% by weight;
• component (C) is present at a level of less than about 40% by weight;
• and component (D) and (E) are present at a level in a range between about 0.008% by weight and about 10% by weight based on the combined weight of silicone resin (A), epoxy resin (B), a siloxane surfactant (D) anhydride curing agent (C), and ancillary curing catalyst (E).

A method of encapsulating a solid state device comprising:

• placing a solid state device into a package;
• and providing an encapsulant comprising:
• (A) at least one silicone resin, (B) at least one epoxy resin (C) at least one anhydride curing agent (D) at least one siloxane surfactant, and (E) at least one ancillary curing catalyst, wherein the silicone resin (A) comprises a silicone resin of structure (I)
• wherein R is independently at each occurrence a hydroxyl group, C1-22 alkyl, C1-22 alkoxy, C2-22 alkenyl, C6-14 aryl, C6-22 alkyl-substituted aryl, C6-22 aralkyl, or OSiR3 wherein R3 is independently at each occurrence hydroxyl, C1-22 alkyl, C1-22 alkoxy, C2-22 alkenyl, C6-14 aryl, C6-22 alkyl-substituted aryl, or C6-22 aralkyl;
• and wherein z is in a range between about 1 and about 10.

A method of encapsulating a LED device comprising:

• placing a LED device into a package and providing an encapsulant comprising:
• (A) a silicone resin comprising hydroxyfunctionalized silicone, (B) an epoxy resin comprising bisphenol F, (C) an anhydride curing agent comprising hexahydro-4-methylphthalic anhydride, (D) a siloxane surfactant comprising ethylene oxide functionalized siloxane, and (E) an ancillary curing catalyst comprising zinc octoate, wherein component (A) is present at a level of greater than about 40% by weight;
• component (B) is present at a level in a range of between about 1% by weight and about 20% by weight;
• component (C) is present at a level of less than about 40% by weight;
• and component (D) and (E) are present at a level in a range between about 0.008% by weight and about 10% by weight based on the combined weight of the silicone resin (A), epoxy resin (B), siloxane surfactant (C), curing agent (D), and ancillary curing catalyst (E).