Methods and apparatus for thermal management of an integrated circuit die

A microprocessor comprising:

• a die having a plurality of functional units formed thereon;
• internal clock circuitry formed on the die and coupled to at least one of the plurality of functional units;
• and
• a thermal management system formed directly on the die, the thermal management system including
• a temperature detection element including at least one temperature sensor having an output, the at least one temperature sensor including
• a reference voltage source providing a reference voltage,
• a programmable voltage source providing a programmable voltage proportional to a temperature of the die, and
• a comparator having one input coupled via a first signal line to the reference voltage source and another input coupled via a second signal line to the programmable voltage source, the comparator to provide a signal at the output of the at least one temperature sensor in response to the programmable voltage substantially equaling the reference voltage;
• a power modulation element to reduce power consumption of at least one of the functional units in response to the output of the at least one temperature sensor;
• a control element including at least one register to provide an enable/disable bit for the thermal management system;
• and
• a visibility element to indicate a status of the output of the at least one temperature sensor.

A computer system comprising:

• at least one memory device coupled to a bus;
• and
• at least one microprocessor coupled to the bus, the at least one microprocessor including
• a die having a plurality of functional units formed thereon;
• internal clock circuitry formed on the die and coupled to at least one of the plurality of functional units;
• and
• a thermal management system located on the die, the thermal management system including
• a temperature detection element formed directly on the die, the temperature detection element including at least one temperature sensor having an output, the at least one temperature sensor including
• a reference voltage source providing a reference voltage,
• a programmable voltage source providing a programmable voltage proportional to a temperature of the die, and
• a comparator having one input coupled via a first signal line to the reference voltage source and another input coupled via a second signal line to the programmable voltage source, the comparator to provide a signal at the output of the at least one temperature sensor in response to the programmable voltage substantially equaling the reference voltage;
• a power modulation element formed directly on the die, the power modulation element to reduce power consumption of at least one of the functional units in response to the output of the at least one temperature sensor;
• a control element formed directly on the die, the control element including at least one register to provide an enable/disable bit;
• and
• a visibility element formed directly on the die, the visibility element to indicate a status of the output of the at least one temperature sensor.

A method comprising:

• providing an enable bit to a register to activate a thermal management system of a die;
• measuring a temperature on the die with a sensor of the thermal management system;
• providing a first state at an output of the sensor when the temperature is below a trip point;
• providing a second state at the sensor output when the temperature equals or exceeds the trip point;
• in response to the sensor output having the second state, engaging a power reduction mechanism for a specified time interval to reduce power consumption of the die;
• polling the sensor output after expiration of the specified time interval;
• if the sensor output exhibits the second state when polled, repeating the acts of engaging the power reduction mechanism for the specified time interval and polling the sensor output after expiration of the specified time interval;
• and
• if the sensor output exhibits the first state when polled, halting the power reduction mechanism.

An apparatus comprising:

• a temperature detection element, the temperature detection element including at least one temperature sensor having an output;
• a power modulation element, the power modulation element to reduce power consumption of an integrated circuit die in response to the output of the at least one temperature sensor;
• a visibility element, the visibility element to indicate a status of the output of the at least one temperature sensor, the visibility element including
• a register to indicate the status of the output of the at least one temperature sensor;
• a register providing a sticky bit;
• a counter to count a number of lost clock cycles resulting from operation of the apparatus;
• and
• circuitry to generate an interrupt when the output of the at least one temperature sensor transitions to a different state.