Method and apparatus using integrated metrology data for pre-process and post-process control

A method, comprising:

• providing a lot of semiconductor wafers;
• determining if pre-process metrology data is to be acquired for a first semiconductor wafer within said lot of semiconductor wafers;
• performing a pre-process integrated metrology data acquisition relating to said first semiconductor wafer;
• performing a first process operation on said first semiconductor wafer at least partially during the process of acquiring pre-process metrology data from a second semiconductor wafer within said lot of semiconductor wafers;
• acquiring post-process integrated metrology data relating to said first semiconductor wafer in response to processing of said first semiconductor wafer, said post-process integrated metrology data comprising data acquired using a metrology tool integrated into a processing tool used to process said semiconductor wafers;
• analyzing said pre-process and said post-process metrology data for evaluation of said process operation performed on said first semiconductor wafer;
• performing a feed-forward adjustment for a subsequent process operation performed on said first semiconductor wafer based upon said evaluation;
• and
• performing a feedback adjustment for a subsequent process operation performed on said second semiconductor wafer based upon said evaluation.

A system, comprising:

• a process controller to perform an integrated metrology data acquisition operation comprising:
• performing a pre-process integrated metrology data acquisition relating to a first semiconductor wafer within a lot of semiconductor wafers;
• performing a first process operation on said first semiconductor wafer at least partially during the process of acquiring pre-process metrology data from a second semiconductor wafer within said lot of semiconductor wafers;
• acquiring post-process integrated metrology data relating to said first semiconductor wafer in response to processing of said first semiconductor wafer;
• analyzing said pre-process and said post-process metrology data for evaluation on said process operation performed on said first semiconductor wafer;
• performing a feed-forward adjustment for a subsequent process operation performed on said first semiconductor wafer based upon said evaluation;
• performing a feedback adjustment for a subsequent process operation performed on said second semiconductor wafer based upon said evaluation;
• an integrated metrology data storage unit operatively coupled to said process controller, said integrated metrology data storage unit to receive and store said pre-process and post-process integrated metrology data;
• and
• a processing tool operatively coupled to said process controller, said processing tool to perform said first process operation and acquire said pre-process and post-process integrated metrology data, said processing toll comprising;
• a process chamber for performing said first process operation;
• and
• and integrated metrology tool for acquiring said pre-process and post-process integrated metrology data, said integrated metrology tool being integrated within said processing tool.

An apparatus, comprising:

• means for providing a lot of semiconductor wafers;
• means for performing a pre-process integrated metrology data acquisition relating to a first semiconductor wafer within said lot of semiconductor wafers, said pre-process integrated metrology data comprising data acquired using a metrology tool integrated into a processing tool used to process said semiconductor wafers;
• means for performing a first process operation on said first semiconductor wafer at least partially during the process of acquiring pre-process metrology data from a second semiconductor wafer within said lot of semiconductor wafers;
• means for acquiring post-process integrated metrology data relating to said first semiconductor wafer in response to processing of said first semiconductor wafer, said post-process integrated metrology data comprising data acquired using said metrology tool integrated into said processing tool used to process said semiconductor wafers;
• and
• means for analyzing said pre-process and said post-process and said post-process metrology data for evaluation of said process operation performed on said first semiconductor wafer.

A computer readable program storage device encoded with instructions that, when executed by a computer, performs a method, comprising:

• providing a lot of semiconductor wafers;
• performing a pre-process integrated metrology data acquisition relating to a first semiconductor wafer within said lot of semiconductor wafers, said pre-process integrated metrology data comprising data acquired using a metrology tool integrated into a processing tool used to process said semiconductor wafers;
• performing a first process operation on said first semiconductor wafer at least partially during the process of acquiring pre-process metrology data from a second semiconductor wafer within said lot of semiconductor wafers;
• acquiring post-process integrated metrology data first semiconductor wafer in response to processing of said first semiconductor wafer, said post-process integrated metrology data comprising data acquired using said metrology tool integrated into said processing tool uses to process said semiconductor wafers;
• and
• analyzing said pre-process and said post-process metrology data for evaluation of said process operation performed on said first semiconductor wafer.

A method, comprising:

• initializing processing of a lot of semiconductor wafers;
• acquiring pre-process metrology data using a metrology tool integrated into a processing tool used to process said semiconductor wafers
• performing a process operation on said first semiconductor wafer at least partially during the process of acquiring pre-process metrology data from a second semiconductor wafer within said lot of semiconductor wafers;
• acquiring post-process metrology data relating to said first semiconductor wafer in response to processing of said first semiconductor wafer, said post-process integrated metrology data comprising data acquired using a metrology tool integrated into a processing tool used to process said semiconductor wafers;
• performing an analysis based upon said pre-process and said post-process metrology data for evaluation of said process operation performed on said first semiconductor wafer;
• and
• processing at least of said second wafer and a third wafer based upon said analysis.