Semiconductor device and process for manufacturing the same
AssigneesHitachi, Ltd., Hitachi Tohbu Semiconductor, Ltd.
InventorsToshio Sugano, Seiichiro Tsukui, Kensuke Tsuneda
Life of this patent
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Abstract
A memory module MM, in which a module wiring substrate 5 is equipped with function switching means KK1 and KK2 for arbitrarily switching function switching signals to be inputted to function switching pins FP0 and FP1 of memories 1. By these function switching means KK1 and KK2, moreover, the function switching signals are arbitrarily switched from any of no connection, a supply voltage Vcc and a ground potential Vss. These signals are inputted altogether to all the mounted memories 1 to switch and arbitrarily set functions including reading modes and refresh cycles.
Claims19
A memory module comprising:
- a semiconductor chip including an accessing operation switching terminal, an accessing operation switching signal being inputted to said accessing operation switching terminal, an accessing operation of said semiconductor chip being decided based on said accessing operation switching signal such that said memory module attains specifications conforming to an external device where it is to be used;
- and
- a printed-wiring substrate having a surface, said semiconductor chip being mounted on said surface of said printed-wiring substrate, and said printed-wiring substrate including an accessing operation switching line for transferring said accessing operation switching signal, said accessing operation switching line being coupled to said accessing operation switching terminal of said semiconductor chip.
A memory module comprising:
- a semiconductor chip including a function switching terminal, a function switching signal being inputted to said function switching terminal, a function of said semiconductor chip being decided based on said function switching signal such that said memory module attains specifications conforming to an external device where it is to be used;
- and
- a printed-wiring substrate having a surface, said semiconductor chip being mounted on said surface of said printed-wiring substrate, and said printed-wiring substrate including a function switching line for transferring said function switching signal, said function switching line being coupled to said function switching terminal of said semiconductor chip.
A memory module comprising:
- a semiconductor chip including a function switching terminal, a function of said semiconductor chip being decided based on a state of said function switching terminal such that said memory module attains specifications conforming to an external device where it is to be used;
- and
- a module substrate having a surface, said semiconductor chip being mounted on said surface of said module substrate, and said module substrate including a function line coupled to said function switching terminal of said semiconductor chip.
Dependencies are inferred from the claim text.