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US 6,788,537 B2Granted
Heat pipe circuit board
AssigneeFurukawa Electric Co., Ltd.
InventorsYukihiro Saita, Keiji Mashimo
Life of this patent
Estimating the term…
Abstract
A heat pipe circuit board comprising: a heat pipe; at least one insulating layer; a circuit pattern provided on a surface of or inside the at least one insulating layer; and electronic components being mounted on the heat pipe through the insulating layer. The heat pipe is formed by jointing two plate members by friction stir welding, at least one of the two plate members being provided with a recess portion which is a fluid channel of a working fluid.
Claims6
A heat pipe circuit board comprising:
- a heat pipe, said heat pipe being formed by joining two plate members by friction stir welding, at least one of said two plate members being provided with a recess portion which is a fluid channel of a working fluid, said heat pipe including a cooling surface, said cooling surface performing a function of a mounting bracket for mounting said heat pipe on another member;
- at least one insulating layer;
- a circuit pattern provided on a surface of or inside said at least one insulating layer;
- and
- electronic components being mounted on said heat pipe through said insulating layer.
2 more elements
Dependencies are inferred from the claim text.