Inductive miniature component for SMD-mounting and method for the production thereof

A method for producing an inductive miniature component for SMD-mounting, comprising:

• winding of the outwardly projecting connection pegs of a coil support with several turns of a metallic wire winding;
• disposing a coil winding in a selected one of a disposition in the coil support and a disposition on the coil support, the coil winding being formed of coil winding wire, the diameter of the metallic wire winding being greater than the diameter of the coil winding wire;
• if a lacquer insulation is present on an end of the coil winding wire, removing the lacquer insulation on the end of the coil winding wire;
• optionally pre-applying tin to the end of the coil winding wire;
• winding the connection pegs having the metallic wire winding wound therearound with several turns of the end of the coil winding wire of the coil winding;
• and
• placing the end of the coil winding wire of the coil winding in contact with the connection pegs via a selected one of dip brazing and a contact configuration that does not comprise dip brazing.