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US 6,788,091 B1Granted
Method and apparatus for automatic marking of integrated circuits in wafer scale testing
AssigneeLSI Logic Corporation
InventorDavid M. Weber
Life of this patent
Estimating the term…
Abstract
A mechanism if provided for testing newly-manufactured integrated circuits at the wafer stage. Built-in self-test circuitry is used to test each of the die on a wafer in parallel. Then, when a defect is detected, the die marks itself (e.g., by physically destroying a portion of itself through burnout). The present mechanism eliminates the inefficiencies of serial testing of die and of mechanical latency as each die is positioned for testing.
Claims5
A wafer for testing by a testing device, the wafer comprising:
- a plurality of integrated circuits, wherein each integrated circuit includes testing circuitry;
- a network of signal paths on the wafer, wherein the network of signal paths connects the plurality of integrated circuits to two or more connection points;
- a current mirror;
- and
- a plurality of transistors,
- wherein in response to the testing device being connected to the connection points, the testing circuitry performs a test on the plurality of integrated circuits concurrently,
- wherein each integrated circuit includes at least one visible component having an appearance and wherein the at least one visible component permanently changes its appearance in response to failing the test,
- wherein the at least one visible component includes at least one diode-connected transistor,
- wherein the current mirror receives a high current and passes an equal amount of current to each of the plurality of transistors, and
- wherein the plurality of transistors, responsive to an input signal, pass current to the diode-connected transistor, causing the diode-connected transistor to burn up and leave a visible mark.
7 more elements
Dependencies are inferred from the claim text.