Scanning probe system with spring probe
AssigneeXerox Corporation
InventorsThomas Hantschel, Eugene M. Chow, David K. Fork
Life of this patent
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Abstract
Scanning probe systems, which include scanning probe microscopes (SPMs), atomic force microscope (AFMs), or profilometers, are disclosed that use cantilevered spring (e.g., stressy metal) probes formed on transparent substrates. When released, a free end bends away from the substrate to form the cantilevered spring probe, which has an in-plane or out-of-plane tip at its free end. The spring probe is mounted in a scanning probe system and is used to scan or otherwise probe a substrate surface. The probes are used for topography, electrical, optical and thermal measurements.
Claims24
A scanning probe system for determining electrical characteristics between two locations on a sample, the scanning probe system comprising:
- a stage having a surface for mounting the sample;
- a probe assembly including:
- a substrate,
- a first spring probe having a fixed end attached to the substrate, a curved central section bending away from the substrate, and a free end including a probe tip for contacting a first location of the sample, and
- a second spring probe having a fixed end attached to the substrate, a curved central section bending away from the substrate, and a free end including a probe tip for contacting a second location of the sample;
- and
- an electrical measurement device having a first terminal connected to the first spring probe, and a second terminal connected to the second spring probe,
- wherein the first and second spring probes comprise stress-engineered spring material films having an internal stress gradient.
A scanning probe system for probing a sample, the scanning probe system comprising:
- a stage having a surface for mounting the sample;
- a probe assembly including a substrate and a spring probe having a fixed end attached to the substrate, a central section separated from the substrate, and a free end including a probe tip positioned adjacent to the stage surface;
- and
- an electrical measurement device coupled to the spring probe,
- wherein the spring probe comprises a stress-engineered spring material film having an internal stress gradient.
A scanning probe system for determining electrical characteristics of a sample, the scanning probe system comprising:
- a stage having a surface for mounting the sample;
- a probe assembly including:
- a transparent substrate, and
- a spring probe having a fixed end attached to the transparent substrate, a curved central section bending away from the substrate, and a free end including a probe tip for contacting a corresponding location of the sample;
- means for observing a surface of the sample through the transparent substrate;
- means for aligning the spring probe based on information generated by said observing means such that the tip of the spring probe contacts a first location on the sample;
- and
- means coupled to the spring probe for measuring electrical characteristics of the first location by measuring electrical signals generated on the spring probe,
- wherein the spring probe comprises a stress-engineered spring material film having an internal stress gradient.
A scanning probe system for determining electrical characteristics of a sample, the scanning probe system comprising:
- a stage having a surface for mounting the sample;
- a probe assembly including:
- a substrate, and
- a spring probe having a fixed end attached to the substrate, a curved central section bending away from the substrate, and a free end including a probe tip for contacting a corresponding location of the sample;
- means for moving the tip of the spring probe relative to the sample such that the tip of the spring probe scans along a surface of the sample;
- and
- means coupled to the spring probe for measuring electrical characteristics of sample by measuring electrical signals generated on the spring probe,
- wherein the spring probe comprises a stress-engineered spring material film having an internal stress gradient.
Dependencies are inferred from the claim text.