DUT board for eliminating electrostatic discharge damage
AssigneeUnited Microelectronics Corp.
InventorChien-Hung Wang
Life of this patent
Estimating the term…
Abstract
An IC tester system for eliminating electrostatic discharge damage. The IC tester system includes a temperature control oven and an IC test board. The IC test board contacts a dummy conducting wire and a grounding interface for grounding out the electrostatic discharge (ESD) generated during the loading and unloading of the test board through thermal-insulated rubber installed in the door of the oven.
Claims17
A device under test (DUT) board for eliminating electrostatic discharge damage while testing electric properties of a DUT, the DUT board comprising:
- a board body;
- a DUT socket installed in the board body for receiving the DUT;
- a testing interface located in a fringe of the board body;
- a grounding interface located in another fringe of the board body;
- a testing conducting wire laid on the board body, one end being electrically connected to the DUT socket, another end being connected to the testing interface;
- and
- a dummy conducting wire laid on the board body, one end being electrically connected to the testing conducting wire, another end being connected to the grounding interface;
- wherein the dummy conducting wire is used to ground out the electrostatic discharge (ESD) generated during a loading and unloading action of the DUT board through a temperature control oven door.
An IC tester system comprising:
- a temperature control oven comprising:
- an oven body for containing a DUT board and providing proper testing temperature;
- a door having thermal-insulated material connected to the oven body, the thermal-insulated material having at least a long gap;
- a DUT board for eliminating electrostatic discharge damage comprising:
- a board body;
- a DUT socket installed in the board body for receiving a DUT;
- a testing interface located in a fringe of the board body;
- a grounding interface located in another fringe of the board body;
- a testing conducting wire laid on the board body, wherein one end is electrically connected to the DUT socket, and another end is connected to the testing interface;
- a dummy conducting wire laid on the board body, wherein one end is electrically connected to the testing conducting wire, and another end is connected to the grounding interface;
- and
- a testing unit connected to the testing interface for testing the DUT;
- wherein the testing interface passes through the long gap of the thermal-insulated material in the door when testing.
An IC tester device for eliminating electrostatic discharge damage while testing a DUT, the IC tester device comprising:
- a temperature control oven comprising:
- an oven body for providing proper testing temperature;
- a door having thermal-insulated material connected to the oven body, the thermal-insulated material having at least a long gap;
- a DUT board plugged in the gap of the thermal-insulated material comprising:
- a board body containing a first part and a second part, wherein when testing, the first part is inside the oven body and the second part is outside the oven body;
- a DUT socket set up in the first part of the board body for receiving a DUT;
- a testing interface located in a fringe of the second part of the board body;
- a grounding interface located in a fringe of the first part of the board body;
- a testing conducting wire laid on the board body, wherein one end is electrically connected to the DUT socket, and another end is connected to the testing interface;
- a dummy conducting wire laid on the board body,
- wherein one end is electrically connected to the testing conducting wire, and another end is connected to the grounding interface;
- and
- a testing unit connected to the testing interface for testing the DUT.
Dependencies are inferred from the claim text.