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US 6,787,930 B1Granted
Alignment marks and manufacturing method for the same
AssigneeNEC LCD Technologies, Ltd.
InventorsShinichi Nakata, Yuji Yamamoto, Mamoru Okamoto, Michiaki Sakamoto, Hironori Kikkawa, Muneo Maruyama
Life of this patent
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Abstract
Alignment marks are formed when source and drain electrodes of a TFT are formed and thereon a thick red filter in formed. So that, the following respective color layers can be made thin on the red filter. Also, the exposure alignment laser permeates in an exposure step, and thereby the alignment marks can be accurately detected.
Claims10
An alignment marking system comprising:
- an alignment beam, a wafer, first alignment marks formed on a surface of the wafer, and second alignment marks formed completely covering the first alignment marks,
- wherein the second alignment marks and the first alignment marks are formed on the same wafer,
- wherein the second alignment marks allow the alignment beam to permeate and the first alignment marks reflect the alignment beam, and
- wherein the first alignment marks and a black matrix are disposed on separate layers of the wafer.
1 more element
An alignment marking system comprising:
- a wafer, fourth alignment marks formed over the wafer, and fifth alignment marks provided on the fourth alignment marks, wherein the total thickness of the fourth alignment marks and the fifth alignment marks are formed to be 0.5 μm or more in thickness, and
- wherein the first alignment marks and a black matrix are disposed on separate layers of the wafer.
An alignment marking system comprising:
- an alignment beam, a wafer, first alignment marks formed on a surface of the wafer, and third alignment marks formed on the same surface of the wafer, said third alignment marks provided in the vicinity of the first alignment marks,
- wherein the third alignment marks are formed based on the first alignment marks as a reference, and said third alignment marks form a step portion for diffracting the alignment beam, and
- wherein the first alignment marks and a black matrix layer are disposed on the wafer in different layers.
Dependencies are inferred from the claim text.