Semiconductor device having a flat protective adhesive sheet
AssigneeDenso Corporation
InventorsShinji Yoshihara, Yasuo Souki, Kinya Atsumi, Hiroshi Muto
Life of this patent
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Abstract
A semiconductor device has a semiconductor wafer having sensing portions exposed on a surface thereof and an adhesive sheet attached to the semiconductor wafer as a protective cap to cover the sensing portions. The adhesive sheet is composed of a flat adhesive sheet and adhesive disposed generally on an entire surface of the adhesive sheet. Adhesion of the adhesive is selectively reduced by UV irradiation to have adhesion reduced regions, and the adhesion reduced regions face the sensing portions. The protective cap can be produced with high productivity, and securely protect the sensing portions when the semiconductor wafer is diced and is transported.
Claims11
A semiconductor device comprising:
- a semiconductor wafer having a structure portion exposed on a surface thereof;
- and
- an adhesive sheet detachably attached to the surface of the semiconductor wafer and covering the structure portion, the adhesive sheet having a flat sheet member and an adhesive portion provided generally on an entire surface of the sheet member, the adhesive portion having a specific region facing the structure portion and a vicinal region surrounding the specific region, where the snecific region exhibits an adhesive characteristic having a value less than an adhesive characteristic exhibited by the vicinal region.
A semiconductor device comprising:
- a semiconductor wafer having a structure portion exposed on a surface thereof;
- and
- an adhesive sheet detachably attached to the surface of the semiconductor wafer and covering the structure portion, the adhesive sheet having a flat sheet member and an adhesive portion provided generally on an entire surface of the sheet member, the adhesive portion having a specific region facing the structure portion, the specific region having an adhesion less than that of a vicinal region of the adhesive portion surrounding the specific region, wherein at least one of the adhesive sheet and the adhesive portion is made of a conductive material.
A semiconductor device comprising:
- a semiconductor wafer having a structure portion exposed on a surface thereof;
- and
- an adhesive sheet detachably attached to the surface of the semiconductor wafer and covering the structure portion, the adhesive sheet having a flat sheet member and an adhesive portion provided generally on an entire surface of the sheet member and exhibiting an adhesion that varies across the surface of the sheet member.
A semiconductor device comprising:
- a semiconductor wafer having a structure portion exposed on a surface thereof;
- and
- an adhesive sheet detachably attached to the surface of the semiconductor wafer and covering the structure portion, the adhesive sheet having a flat sheet member and an adhesive portion provided generally on an entire surface of the sheet member, the adhesive portion having a specific region facing the structure portion, the specific region having an adhesion less than that of a vicinal region of the adhesive portion surrounding the specific region, wherein a sensing element is formed on the structural portion of the semiconductor wafer.
Dependencies are inferred from the claim text.