Integrated circuit device having pads structure formed thereon and method for forming the same
AssigneeRealtek Semiconductor Corp.
InventorYing-Hsi Lin
Life of this patent
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Abstract
The invention is to provide a structure of IC pad and its forming method. The structure is arranged in an insulation layer and is comprised of a lower electric-conduction layer, a compound layer structure and a pad layer. The lower electric-conduction layer is arranged at an appropriate position in the insulation layer and is connected to an electric potential. The compound layer structure is arranged on the insulation layer and is composed of at least one electric-conduction layer and at least one electric-conduction connecting layer, both are inter-overlapped to each other. The pad layer is arranged on the compound layer structure.
Claims22
An integrated circuit (IC) device having a pad structure formed thereon, the IC device comprising:
- a) a substrate;
- b) an insulation layer formed on the substrate;
- c) a lower electric-conduction layer formed in the insulation layer;
- d) a compound layer structure formed in the insulation layer;
- e) a first pad layer formed on the insulation layer and coupled to the compound layer structure, wherein the first pad layer and the compound layer structure are spaced apart from the lower electric-conduction layer;
- and
- f) a second pad layer formed on the insulation layer and coupled to the lower electric-conduction layer.
An integrated circuit (IC) device having a pad structure formed thereon, the IC device comprising:
- a) a substrate;
- b) an insulation layer formed on the substrate;
- c) a lower electric-conduction layer formed in the insulation layer;
- d) a compound layer structure formed in the insulation layer;
- and
- e) a first pad layer formed on the insulation layer and coupled to the compound layer structure, wherein the first pad layer and the compound layer structure are spaced apart from the lower electric-conduction layer.
A method for fabricating an IC device having a pad structure formed thereon, the method comprising:
- a) providing a substrate;
- b) forming an insulation layer formed on the substrate;
- c) forming a lower electric-conduction layer formed in the insulation layer, at least a part of the lower electric-conduction layer being covered by the insulation layer;
- d) forming a compound layer structure formed in the insulation layer, the compound layer structure being spaced apart from and not connected to the lower electric-conduction layer;
- and
- e) forming a first pad layer formed on the insulation layer, the first pad layer being coupled to the compound layer,
- wherein in the forming a first pad layer step e) the first pad layer and the compound layer are spaced apart from the lower electric-conduction layer.
Dependencies are inferred from the claim text.