US 6,787,926 B2 · Wire stitch bond on an integrated circuit bond pad and method of making the same

Abstract

A microelectronic assembly, and method of making the same, including a wire stitch bonded on an electroplated gold bump or electroless nickel/gold bump on a bond pad of an integrated circuit chip. The electroplated gold bump or electroless nickel/gold bump provides a relatively flat upper surface which is excellent for making a wire stitch bond thereto. The microelectronic assembly may include a multiple integrated circuit chip stack attached to a substrate such as a ball grid array. The electroplated gold bumps or electroless nickel/gold bumps may be formed on all of the integrated circuit chips and wire stitch bonds formed on the electroplated gold bumps or electroless nickel/gold bumps thereby connecting the integrated circuit chips to each other or to an underlying ball grid array.

Claims24

Dependent claims

A microelectronic assembly comprising:

a first semiconductor device having a first bond pad formed thereon and a first passivation layer over at least a portion of the first semiconductor device, and wherein the first passivation layer includes a portion overlying the first bond pad and an opening formed in the first passivation layer down to the first bond pad, and a first raised electrical contact feature formed over the first bond pad and wherein the first raised electrical contact feature fills the opening formed in the first passivation layer and the first raised electrical contact feature including a substantially flat upper surface, and a first wire having a first end stitch bonded to the substantially flat upper surface of the first raised feature.

Dependencies are inferred from the claim text.

Wire stitch bond on an integrated circuit bond pad and method of making the same

Life of this patent

Wire stitch bond on an integrated circuit bond pad and method of making the same

Life of this patent

Abstract

Claims24