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US 6,787,920 B2Granted
Electronic circuit board manufacturing process and associated apparatus
AssigneeIntel Corporation
InventorDudi Amir
Life of this patent
Estimating the term…
Abstract
A carrier substrate comprising a non-conductive substrate, one or more conductive regions on, under or within the non-conductive substrate, and a plurality of pads, selectively coupled with the conductive regions, to receive and couple with conductive elements of a component, wherein at least one pad is configured to receive and couple with two or more conductive elements of the component.
Claims12
A carrier substrate comprising:
- a non-conductive substrate;
- one or more conductive regions on, under or within the non-conductive substrate;
- and
- a plurality of pads, selectively coupled with the conductive regions, to receive and couple with balls of an integrated circuit chip, wherein at least one pad is configured to receive and couple with two or more balls of the integrated circuit chip, and is longer and narrower than the pad(s) configured to receive and couple with only one ball of the integrated circuit chip.
1 more element
An electronic circuit board comprising:
- a non-conductive substrate;
- one or more conductive regions on or within the non-conductive substrate;
- a plurality of pads, selectively coupled with the conductive region(s);
- and
- one or more integrated circuit chip coupled with the pads, wherein two or more balls of the integrated circuit chip are coupled with a single pad that is longer and narrower than the pad(s) coupled with only one ball of the integrated circuit chip.
2 more elements
Dependencies are inferred from the claim text.