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US 6,787,919 B2Granted
Flip-chip opto-electronic circuit
AssigneeIntel Corporation
InventorJun Su
Life of this patent
Estimating the term…
Abstract
A thermo-optic switch comprises two planar waveguide and a heating element couple to at least one of the planar waveguides. The heating element is coupled to a package substrate using solder bumps.
Claims10
A thermo-optic switch comprising:
- a first substrate having a first waveguide;
- a heating element in proximity to the first waveguide;
- and
- a package substrate solder bonded to the first substrate via the heating element.
1 more element
A 2×2 thermo-optic switch, comprising:
- a first substrate having a first waveguide and a substantially parallel second waveguide separated by a distance;
- a first heating element in proximity to the first waveguide;
- a second heating element in proximity to the second waveguide;
- and
- a package substrate comprising:
- a first conductive strip solder bonded to said first heating element;
- a second conductive strip solder bonded to said second heating element;
- and
- a third common conductive strip spanning said distance and solder bonded to both said first beating element and said second heating element.
6 more elements
A thermo-optic switch comprising:
- a first substrate having a plurality of waveguides;
- a plurality of heating elements in proximity to each of said plurality of waveguides;
- and
- a package substrate having a plurality of conducting strips each solder bonded to one of said plurality of heating elements and further having a common conducting strip solder bonded to the plurality of heating elements.
1 more element
Dependencies are inferred from the claim text.