Semiconductor integrated circuit device
AssigneeRenesas Technology Corp.
InventorsSatoshi Koyama, Tetsuo Sato
Life of this patent
Estimating the term…
Abstract
A main circuit block and a sub-circuit block are located alongside of each other on a substrate of a semiconductor integrated circuit device. A plurality of bonding pads, which are connected to external leads of the device, are disposed around the main circuit block. A plurality of first wires are disposed extending from the main circuit block into space between the bonding pads. Each wire has a shape connectable to another wire, for example the wire has a tip having a portion perpendicular to the semiconductor substrate, or the wire has a tip having a cross-wire portion which intersect with an extended line of the wire. A plurality of second wires are extended from the sub-circuit block, and each electrically connected to one of the first wires.
Claims15
A semiconductor integrated circuit device comprising:
- a semiconductor substrate;
- a circuit block on the substrate;
- a plurality of bonding pads disposed around the circuit block, and being connected to external leads of the semiconductor integrated circuit device;
- and
- a plurality of wires extending from the circuit block between, but not in contact with, the bonding pads, each wire having a shape connectable to another wire.
A semiconductor integrated circuit device comprising:
- a semiconductor substrate;
- a main circuit block and a sub-circuit block disposed alongside of each other with a distance therebetween on the substrate;
- a plurality of bonding pads disposed between the main circuit block and the sub-circuit block, and being connected to external leads of the semiconductor integrated circuit device;
- a plurality of first wires extending in a direction from the main circuit block to the plurality of bonding pads;
- and
- a plurality of second wires extending from the sub-circuit block and each electrically connected to one of the first wires.
A semiconductor integrated circuit device comprising:
- a semiconductor substrate;
- a main circuit block and a sub-circuit block disposed alongside of each other with a distance therebetween on the substrate;
- a plurality of bonding pads disposed between the main circuit block and the sub-circuit block, and being connected to external leads of the semiconductor integrated circuit device;
- a plurality of first wires extending from the main circuit block between, but not in contact with, the plurality of bonding pads;
- and
- a plurality of second wires extending from the sub-circuit block and each electrically connected to one of the first wires.
Dependencies are inferred from the claim text.