Electronic assemblies with solidified thixotropic thermal interface material

An integrated circuit (IC) package comprising:

• a die having a front surface comprising a plurality of terminals, and the die further having a back surface;
• a plate adjacent to the back surface of the die;
• and
• a solidified thixotropic metal alloy material between the die and the plate.

An integrated circuit (IC) package comprising:

• a die;
• a plate adjacent to the die and including
• a substantially planar upper surface
• a lower surface comprising a die-fitting area having equivalent dimensions to those of the die, and having a pair of boundaries in physical contact with the die;
• an inlet in the upper surface;
• an outlet in the upper surface;
• an inlet ramp extending downwardly from the inlet to the die-fitting area and in physical contact with both the inlet and the die-fitting area;
• and
• an outlet ramp extending upwardly from the die-fitting area to the outlet and in physical contact with both the die-fitting area and the outlet;
• and
• a solidified material between the die and the plate formed by flowing a thermally conductive material between the die and the plate.

A package comprising:

• a die having a front surface comprising a plurality of terminals, and the die further having a back surface;
• a plate adjacent to the back surface of the die;
• and
• a solidified thixotropic metal alloy material between the die and the plate formed by flowing a thermally conductive semi-solid metal alloy material between the die and the plate.