Molded semiconductor power device having heat sinks exposed on one surface

A semiconductor device comprising:

• a semiconductor chip, which generates heat;
• a first heat sink, which is electrically and thermally connected to a first surface of the semiconductor chip for functioning as an electrode for the semiconductor chip and releasing the heat;
• a second heat sink, which is electrically and thermally connected to a second surface of the semiconductor chip for functioning as an electrode for the semiconductor chip and releasing the heat;
• an insulating layer, which is located between the heat sinks;
• and
• a mold resin, wherein the semiconductor chip, the heat sinks, and the insulating layer are covered with the mold resin such that one of the heat sinks is exposed on a substantially flat surface of the mold resin and wherein the heat sinks are thermally connected by the insulating layer.

A semiconductor package, comprising:

• a semiconductor chip;
• a first heat sink electrically and thermally connected to a first surface of the semiconductor chip for functioning as an electrode for the semiconductor chip and for releasing heat generated by the semiconductor chip;
• a second heat sink electrically and thermally connected to a second surface of the semiconductor chip for functioning as an electrode for the semiconductor chip and for releasing the heat generated by the semiconductor chip;
• and
• a mold resin covering the semiconductor chip and the heat sinks such that the first heat sink is exposed on one substantially flat surface defined by the mold resin,
• wherein the second heat sink includes a center portion attached to the second surface of the semiconductor chip and at least one end portion attached to a surface of the first heat sink.