Leadless chip carrier for reduced thermal resistance

A structure comprising:

• a plurality of semiconductor dies;
• a substrate having a plurality of cutout sections, each of said plurality of semiconductor dies being situated in a respective one of said plurality of cutout sections;
• a printed circuit board having a plurality of support pads on a top surface of said printed circuit board and at least one via situated in said printed circuit board, said at least one via being in thermal and electrical contact with at least one of said plurality of support pads;
• said substrate being situated on said printed circuit board and each of said plurality of semiconductor dies being situated on a respective one of said plurality of support pads.

A method for fabricating a structure for receiving a semiconductor die, said method comprising steps of:

• forming a first cutout section in a substrate;
• inserting a first semiconductor die in said first cutout section;
• securing said first semiconductor die to said substrate;
• placing said substrate on a top surface of a printed circuit board, said top surface of said printed circuit board having a support pad, said printed circuit board having at least one via situated in said printed circuit board, said at least one via being in thermal and electrical contact with said support pad, said first semiconductor die being situated on said support pad.

A structure comprising:

• a plurality of semiconductor dies;
• a substrate having a plurality of cutout sections, each of said plurality of semiconductor dies being situated in a respective one of said plurality of cutout sections;
• a printed circuit board having a plurality of support pads on a top surface of said printed circuit board;
• said substrate being situated on said printed circuit board and each of said plurality of semiconductor dies being situated on a respective one of said plurality of support pads;
• wherein a respective semiconductor die bond pad on a respective one of said plurality of semiconductor dies is connected to a substrate bond pad on said substrate.

A method for fabricating a structure for receiving a semiconductor die, said method comprising steps of:

• forming a first cutout section in a substrate, said substrate comprising a fiber glass based laminate material;
• inserting a first semiconductor die in said first cutout section;
• securing said first semiconductor die to said substrate;
• placing said substrate on a top surface of a printed circuit board, said top surface of said printed circuit board having a support pad, said first semiconductor die being situated on said support pad.

A method for fabricating a structure for receiving a semiconductor die, said method comprising steps of:

• forming a first cutout section in a substrate;
• inserting a first semiconductor die in said first cutout section;
• securing said first semiconductor die to said substrate;
• placing said substrate on a top surface of a printed circuit board, said top surface of said printed circuit board having a support pad, said first semiconductor die being situated on said support pad;
• connecting a semiconductor die bond pad on said first semiconductor die to a substrate bond pad on said substrate by using a bonding wire.