US 6,787,890 B2 · Optical package structure

Abstract

An optical package structure (2) includes a cover (21) with a lens part (22), and a base member (23) which combines with the cover to define a closed space in which to package optical components. The base member has a bottom panel (232) and a substrate (234). A plurality of solder pads (231, 237) is provided on a top and bottom surfaces (2321, 2342) of the bottom panel and of the substrate. The solder pads on the top surface electrically connect with the optical components. A plurality of inner conductive traces (236, 238) is provided through the bottom panel and the substrate which electrically connect the solder pads on the top surface of the bottom panel with corresponding solder pads on the bottom surface of the substrate via printed circuits (235) on the substrate. Thus, an external electrical connection of the optical components is attained without wires and electrical pins.

Claims10

Dependent claims

An optical package structure comprising:

a cover with a lens part in a top portion of the cover;
a base member combining with the cover to define a closed space to package optical components therein;
and
an engaging part surrounding the cover for engaging with an optical fiber or other optical component, and having an opening for making assembly and disassembly of the engaging part to and from the cover easy;
wherein a plurality of solder pads is provided on both a top and a bottom surface of the base member, and a plurality of inner conductive traces which extends through the base member is provided to electrically connect the solder pads on the top surface to the solder pads on the bottom surface.

2 more elements

Dependencies are inferred from the claim text.

Optical package structure

Life of this patent

Optical package structure

Life of this patent

Abstract

Claims10