Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production

A circuit component package comprising:

• a mounting member including a substrate and a wiring pattern provided on the substrate;
• a circuit component including a component body and an external electrode provided at an end of the component body, the circuit component being arranged on the mounting member;
• and
• a conductive material that electrically connects the external electrode with the wiring pattern,
• wherein
• in the circuit component,
• the component body is shaped so that a first portion of the component body on which the external electrode is provided is thinner than a second portion of the component body, the second portion being a portion on which the external electrode is not provided, and
• the external electrode is arranged in a region on a side on which the component body is positioned with respect to a reference plane containing a predetermined surface of the component body, the predetermined surface of the component body being a surface of the component body that is to be opposed to the mounting member when the circuit component is mounted on the mounting member, and
• the circuit component is arranged on the mounting member so that the component body is in contact with the mounting member.

A circuit component built-in module comprising:

• a circuit component including a component body and an external electrode provided at an end of the component body;
• a first wiring pattern electrically connected with the external electrode of the circuit component;
• a conductive material electrically connecting the external electrode with the first wiring pattern;
• and
• an electric insulation member incorporating the circuit component,
• wherein, in the circuit component,
• the component body is shaped so that a first portion of the component body on which the external electrode is provided is thinner than a second portion of the component body, the second portion being a portion on which the external electrode is not provided, and
• the external electrode is arranged in a region on a side on which the component body is positioned with respect to a reference plane that contains a predetermined surface of the component body, the predetermined surface of the component body being a surface of the component body that is to be opposed to a mounting member when the circuit component is mounted on the mounting member.