Integrated schottky barrier diode and manufacturing method thereof

An integrated Schottky barrier diode chip including a first Schottky barrier diode and a second Schottky barrier diode each formed on a compound semiconductor substrate, the chip comprising:

• an operation layer formed on the substrate;
• an anode electrode;
• a cathode electrode;
• a common electrode;
• a first insulating region and a first impurity region each formed in the operation layer for the first Schottky barrier diode;
• and
• a second insulating region and a second impurity region each formed in the operation layer for the second Schottky barrier diode, wherein
• the first insulating region electrically separates a portion of the operation layer of the first diode that is connected to the anode electrode from a portion of the operation layer of the first diode that is connected to the common electrode, and the second insulating region electrically separates a portion of the operation layer of the second diode that is connected to the common electrode from a portion of the operation layer of the second diode that is connected to the cathode electrode, and
• the first impurity region electrically communicates with the operation layer of the first diode that is connected to the common electrode, and the second impurity region electrically communicates with the operation layer of the second diode that is connected to the cathode electrode.