Optical semiconductor housing and method for making same

An information processing system comprising:

• at least one optical semiconductor package, each of the at least one optical semiconductor package comprising:
• an electrical connection support plate that has a through-passage;
• a semiconductor component, a front face of which has an optical sensor and which is fixed to a rear face of the plate in such a way that its optical sensor is situated opposite the through-passage;
• means of electrical connection of the optical component to the support plate;
• means of encapsulation of the component on the rear face of the support plate;
• a lid, which is at least partly transparent, fixed to a front face of the support plate and covering the through-passage;
• external electrical connection means located on an exposed part of the support plate;
• a second semiconductor component, such as a microprocessor, a front face of which is fixed to a rear face of the optical component;
• means of electrical connection of this second component to the support plate;
• and
• means of encapsulation of the components stacked on the rear face of the support plate.