Semiconductor device having a moveable member therein and a protective member disposed thereon
AssigneeDenso Corporation
InventorsTetsuo Fujii, Tsuyoshi Fukada, Kenichi Ao
Life of this patent
Estimating the term…
Abstract
A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is detached from the protective sheet and the semiconductor wafer bonded together. After that, the semiconductor wafer is cut into semiconductor chips by dicing along the grooves of the protective sheet. Because the protective sheet is not cut by dicing, no scraps of the protective sheet is produced, thereby preventing contamination to the chips.
Claims19
A semiconductor device comprising:
- a semiconductor chip;
- a bump disposed on a surface of the semiconductor chip;
- a protective member disposed on the surface of the semiconductor chip, the protective member having an opening portion from which the bump is exposed;
- and
- a movable portion disposed on a region that is covered by the protective member.
A semiconductor device comprising:
- a semiconductor chip having first and second plane surfaces and diced outer surfaces, the semiconductor chip defining an opening portion that opens to the first plane surface, the semiconductor chip having a movable portion disposed in the opening portion;
- a pad portion formed on the first plane surface and including a bump thereon;
- and
- a protective member disposed on the first surface so as to cover the opening portion and to expose the pad portion.
Dependencies are inferred from the claim text.