Wafer with additional circuit parts in the kerf area for testing integrated circuits on the wafer

A wafer, comprising:

• a plurality of integrated circuits arranged in rows and columns and forming interspaces therebetween, along which said individual integrated circuits are separated from one another after testing with an external test system;
• additional circuit parts integrated in said interspaces;
• each of said additional circuit parts being connected with a respectively associated one of said integrated circuits by at least one connecting line for controlling a function of said integrated circuit;
• at least one contact land formed on each of said additional circuit parts for connecting said each of said additional circuit parts with an external test system;
• each of said additional circuit parts having an intermediate driver configured to disconnect a voltage supplied from the external test system via said each of said additional circuit parts to said associated one of said integrated circuits from an internal voltage of said integrated circuits.