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US 6,787,799 B2Granted
Device and method for detecting a reliability of integrated semiconductor components at high temperatures
AssigneeInfineon Technologies AG
InventorsWilhelm Asam, Josef Fazekas, Andreas Martin, David Smeets, Jochen Von Hagen
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Abstract
The invention relates to a device and a method for detecting the reliability of integrated semiconductor components. The device includes a carrier substrate for receiving an integrated semiconductor component that will be examined, a heating element, and a temperature sensor. The temperature sensor has at least a portion of a parasitic functional element of the semiconductor component. As a result, reliability tests can be carried out in a particularly accurate and space-saving manner.
Claims9
A combination, comprising:
- a carrier substrate;
- a semiconductor component having a parasitic functional element, the semiconductor component being integrated in said carrier substrate;
- a heating element for heating the semiconductor component;
- and
- a temperature sensor for detecting a temperature of the semiconductor component, said temperature sensor formed in said substrate;
- said temperature sensor including at least a portion of said parasitic functional element of the semiconductor component.
3 more elements
Dependencies are inferred from the claim text.