Laser machining of materials

A method for machining a material with ultrashort laser pulses, having the following steps:

• (a) generation of a sequence of first laser pulses, where
• the first laser pulses each have a duration of less than 300 picoseconds and
• the repetition rate for the first laser pulses is in the range between 100 kHz and 1 GHz,
• (b) conversion of a set of first laser pulses into a sequence of second laser pulses for machining the material, where
• the second laser pulses each have a duration of less than 300 picoseconds and
• the pulse repetition rate is in the range between 1 Hz and 1 MHz,
• (c) application of a sequence of selected second laser pulses to the material in order to machine this, and
• (d) application of a second set of first laser pulses to the material in order to test this.

A method for machining, comprising:

• preparing a device comprising:
• a device (1) for generating a sequence of first laser pulses, where
• the first laser pulses each have a duration of less than 300 picoseconds and
• the repetition rate for the first laser pulses is in the range between 100 kHz and 1 GHz,
• a converter (2) for converting the first set of the sequence of first laser pulses into a sequence of second laser pulses for application to and for machining of the material, where
• the second laser pulses each have a duration of less than 300 picoseconds and
• the repetition rate for the second laser pulses is in the range between 1 Hz and 1 Mhz,
• as well as
• a testing device (3, 5, 6, 7, 15) that is equipped to apply first laser pulses, which do not belong to the first set, to the material, to detect specific results of this application and to provide these detected results as information, and
• using said device to
• (a) generate a sequence of first laser pulses, where
• the first laser pulses each have a duration of less than 300 picoseconds and
• the repetition rate for the first laser pulses is in the range between 100 kHz and 1 GHz,
• (b) convert a set of first laser pulses into a sequence of second laser pulses for machining the material, where
• the second laser pulses each have a duration of less than 300 picoseconds and
• the pulse repetition rate is in the range between 1 Hz and 1 MHz,
• (c) apply a sequence of selected second laser pulses to the material in order to machine this, and
• (d) apply a second set of first laser pulses to the material in order to test this.