Ceramic circuit board
AssigneeKYOCERA Corporation
InventorTetsuo Hirakawa
Life of this patent
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Abstract
A ceramic circuit board that protects a metallized wiring layer from fusion when a large electric current is applied thereto. The ceramic circuit board includes a ceramic substrate, a plurality of metallized wiring layers formed on the ceramic substrate, and a metal circuit plate made of copper, which is attached to part of the metallized wiring layers. The condition, S≧6×10−5i2, is fulfilled in the ceramic circuit board, whereby S (mm2) is the sectional area of the metal circuit plate and i (A) the value of a flowing electric current.
Claims18
A ceramic circuit board comprising:
- a ceramic substrate;
- a plurality of metallized wiring layers formed on the ceramic substrate, wherein the metallized wiring layer is made of a silver-copper eutectic alloy added with at least one of titanium, zirconium, hafnium, and hydrides thereof;
- and
- a metal circuit plate made of copper, which is attached to part of the metallized wiring layers,
- wherein a condition:
- S≧6×10−5i2 is fulfilled, wherein S is a sectional area (mm2) of the metal circuit plate and i is a value (A) of a flowing electric current.
A ceramic circuit board comprising:
- a ceramic substrate;
- a plurality of metallized wiring layers formed on the ceramic substrate, wherein the metallized wiring layer is made of a silver-copper eutectic alloy added with at least one of titanium, zirconium, hafnium, and hydrides thereof;
- and
- a metal circuit plate made of aluminum, which is attached to part of the metallized wiring layers,
- wherein a condition:
- S≧9×10−5i2 is fulfilled, wherein S is a sectional area (mm2) of the metal circuit plate and i is a value (A) of a flowing electric current.
A ceramic circuit board comprising:
- a ceramic substrate;
- a plurality of metallized wiring layers formed on the ceramic substrate, wherein the metallized wiring layer is made of a metal selected from the group consisting of tungsten, molybdenum and manganese;
- and
- a metal circuit plate made of copper, which is attached to part of the metallized wiring layers,
- wherein a condition:
- S≧6×10−5i2 is fulfilled, wherein S is a sectional area (mm2) of the metal circuit plate and i is a value (A) of a flowing electric current.
A ceramic circuit board comprising:
- a ceramic substrate;
- a plurality of metallized wiring layers formed on the ceramic substrate, wherein the metallized wiring layer is made of a metal selected from the group consisting of tungsten, molybdenum and manganese;
- and
- a metal circuit plate made of aluminum, which is attached to part of the metallized wiring layers,
- wherein a condition:
- S≧9×10−5i2 is fulfilled, wherein S is a sectional area (mm2) of the metal circuit plate and i is a value (A) of a flowing electric current.
Dependencies are inferred from the claim text.