Structure of joining chip part to bus bars
AssigneeYazaki Corporation
InventorsMasashi Nagao, Hisafumi Maruo, Norihito Suzuki
Life of this patent
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Abstract
A chip part (6) is mounted on bus bars (2, 3), and connection portions (6t) of the chip part (6) are soldered to the bus bars (2, 3), respectively. At this time, recesses (10, 11) are beforehand formed respectively in soldering lands of the two spaced-apart bus bars each corresponding to a predetermined solder wetting area. The chip part is soldered to the bus bars in such a manner that the connecting portions are spaced apart from inner edges of these recesses, respectively, thereby forming a solder fillet between at least part of each of the recesses and the corresponding connecting portion of the chip part.
Claims10
A joining structure comprising:
- two conductive bus bars spaced from each other;
- a chip part including connecting portions for an electric circuit, mounted on the two bus bars;
- recesses formed in soldering lands of the two bus bars, respectively, so that the connecting portions are spaced horizontally apart from inner edges of the recesses;
- and
- a solder fillet formed between at least part of each of the recesses and the corresponding connecting portion.
A joining structure comprising:
- two conductive bus bars spaced from each other:
- a chip part including connecting portions for an electric circuit, mounted on the two bus bars;
- recesses formed in soldering lands of the two bus bars, respectively, so that the connecting portions are spaced apart from inner edges of the recesses;
- and
- a solder fillet formed between at least part of each of the recesses and the corresponding connecting portion,
- wherein each of the recesses includes a projection platform having a height lower than an upper surface of the bus bars, and
- the solder fillets are form in a state that lower surfaces of the connecting portions are held by the projection platforms, respectively.
A joining structure comprising:
- two conductive bus bars spaced from each other;
- a chip part including connecting portions for an electric circuit, mounted on the two bus bars;
- recesses formed in soldering lands of the two bus bars, respectively, so that the connecting portions are spaced apart from inner edges of the recesses;
- and
- a solder fillet formed between at least part of each of the recesses and the corresponding connecting portion,
- wherein each of the recesses includes a flat bottom surface, and
- the solder fillets are formed in a state that lower surfaces of the connecting portions are held against the bottom surface.
Dependencies are inferred from the claim text.