Thermosetting resin composition and process for producing the same

A thermosetting resin composition, wherein a storage modulus of a cured product at 25° C. is 1.0 GPa or more, and a storage modulus thereof at 200° C. is 100 MPa or less, and which contains a silicone polymer having a bifunctional siloxane unit represented by the formula R2SiO2/2 (wherein R is the same or a different organic group) in the molecule.

A thermosetting resin composition comprising, as essential components, (a) an epoxy resin, (b) a curing agent, and (c) a silicone polymer containing a bifunctional siloxane unit represented by the formula R2SiO2/2 (wherein R is the same or a different organic group) in the molecule, and the curing agent (b) includes a phenol resin.

A thermosetting resin composition comprising, as essential components, (a) an epoxy resin, (b) a curing agent, and (c) a silicone polymer containing a bifunctional siloxane unit represented by the formula R2SiO2/2 (wherein R is the same or a different organic group) in the molecule, and the silicone polymer (c) contains a bifunctional siloxane unit represented by the formula R2SiO2/2 (wherein R is the same or a different organic group) and a tetrafunctional siloxane unit represented by the formula SiO4/2 in the molecule.

A thermosetting resin composition comprising, as essential components, (a) an epoxy resin, (b) a curing agent, and (c) a silicone polymer containing a bifunctional siloxane unit represented by the formula R2SiO2/2 (wherein R is the same or a different organic group) in the molecule, and the silicone polymer (c) contains a bifunctional siloxane unit represented by the formula R2SiO2/2 (wherein R is the same or a different organic group), a trifunctional siloxane unit represented by the formula RSiO3/2 (wherein R is the same or a different organic group), and a tetrafunctional siloxane unit represented by the formula SiO4/2 in the molecule.

A thermosetting resin composition comprising an epoxy resin and a curing agent as essential components, wherein a storage modulus of a cured product at 200° C. is 100 MPa or less, and a glass transition temperature of the cured product is 170° or higher.

A thermosetting resin composition comprising an epoxy resin and a curing agent as essential components, wherein a storage modulus of a cured product at 200° C. is 100 MPa or less and which further contains a silicone polymer having a bifunctional siloxane unit by the formula R2SiO2/2 (wherein R is the same or a different organic group) in the molecule.